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TD SYNNEX Appoints Douglas Britt to Board of Directors

TD SYNNEX Appoints Douglas Britt to Board of Directors

TD SYNNEX has announced the appointment of Douglas Britt to its board of directors, effective June 17, 2026, increasing the size of the board from 10 to 11 members. Britt will serve on the board's Audit Committee and Technology Committee.

A seasoned technology executive, Britt brings more than 30 years of experience leading global technology, manufacturing and supply-chain businesses and a strong track record of driving operational excellence and strategic growth. He currently serves as executive chairman of Boyd, where Britt previously served as CEO and led the sale of Boyd Thermal business to Eaton Corp. in 2026. He currently oversees the Boyd Thermal business within Eaton.

"TD SYNNEX has built a strong reputation for helping partners navigate complexity across the technology landscape," Britt said. "I look forward to working with the board and leadership team as the company continues to strengthen its position, adapt to industry change and deliver value across the ecosystem."

Britt currently serves on the boards of Helios Technologies and Benchmark Electronics and has played a key role in numerous value-creation initiatives throughout his career including the development and strategic growth of Nextracker eventually leading to its separation into an independent public company and the expansion of Boyd's Thermal business into a global leader in liquid cooling technologies.

"We are pleased to welcome Doug to our board of directors,” said Ann Vezina, chair, TD SYNNEX Board of Directors. "Doug's deep expertise across technology, manufacturing and supply-chain operations, along with his experience scaling global businesses, will further strengthen our governance and strategic oversight. His perspective will be valuable as we continue to advance our strategy, including our growing hyperscale digital infrastructure capabilities, and deliver for our partners around the world."

Prior to Boyd, Britt served as president of the Integrated Solutions Division of Flex Ltd., a global design, engineering, manufacturing and supply-chain solutions provider. Earlier in his career, he held senior leadership roles at Future Electronics, Silicon Graphics and Solectron. He holds a bachelor of science in business administration from California State University, Chico, and has completed executive education programs in Europe, including at the University of London.

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